Power chips are attached to exterior circuits with packaging, and their performance relies on the assistance of the packaging. In high-power situations, power chips are typically packaged as power components. Chip interconnection describes the electrical link on the upper surface of the chip, which is normally aluminum bonding wire in traditional modules. ^
Traditional power component plan cross-section
Today, business silicon carbide power modules still mainly use the product packaging technology of this wire-bonded traditional silicon IGBT component. They deal with problems such as huge high-frequency parasitic criteria, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation toughness, which restrict the use of silicon carbide semiconductors. The screen of excellent performance. In order to address these troubles and completely make use of the big potential advantages of silicon carbide chips, several brand-new product packaging modern technologies and remedies for silicon carbide power components have actually arised in recent years.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold cord bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold wires to copper cables, and the driving force is price decrease; high-power tools have created from light weight aluminum wires (strips) to Cu Clips, and the driving force is to enhance item efficiency. The better the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared with standard bonding product packaging methods, Cu Clip modern technology has the complying with advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular level, changes the conventional wire bonding technique between the chip and the pins. For that reason, an unique package resistance worth, greater present circulation, and better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can fully save the price of silver plating and bad silver plating.
3. The item appearance is completely regular with typical items and is generally utilized in servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding approach is more expensive and intricate, yet it can accomplish much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad utilizes a Clip approach, and eviction uses a Cord method. This bonding approach is somewhat more affordable than the all-copper bonding technique, conserving wafer location (suitable to really tiny entrance locations). The procedure is simpler than the all-copper bonding approach and can obtain far better Rdson and much better thermal result.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding white copper, please feel free to contact us and send an inquiry.
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